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Driven by the dual wheels of global consumption upgrade and technological transformation, the packaging industry is accelerating towards a new era of specialization, intelligence and sustainability. According to research data from Bezhe Consulting, the global smart packaging market size was 27.575 billion US dollars in 2024 and is projected to reach 38.662 billion US dollars by 2030. Against this backdrop, the swop Packaging World (Shanghai) Expo (hereinafter referred to as 'swop') will once again land at the Shanghai New International Expo Center from November 25th to 27th, 2025. With a 'ten-year appointment' as a bond, it will join hands with the global industry to jointly draw the blueprint for the future of packaging.
As a member of the interpack Alliance, a global packaging exhibition, swop has developed into an influential one-stop procurement platform covering the entire industrial chain in the Asia-Pacific region since its establishment in 2015. 2025 marks the 10th anniversary of swop. The scale of the exhibition will further expand, covering the entire industrial chain links of processing and packaging, including mechanical equipment, packaging materials, packaging products, and printing design. It will also cover eight terminal fields: food, beverages, desserts, baking, medicine, daily chemicals, non-food consumer goods, and industrial products. We are fully committed to creating a 70,000-square-meter industry grand event and a 'supply and demand' platform for the packaging market. With ten years of accumulation and innovation, we aim to integrate industry resources and empower the coordinated development of the global packaging industry.
